In the case of wet coating, in addition to the viscosity and temperature of the liquid (liquid temperature and ambient temperature), surface cleaning and wettability of the coated object are also important factors.

We offer cleaning equipment / surface modification equipment for better dip coating.


UV cleaning/surface modification

This is one of the cleaning and surface modification methods to improve adhesion and bonding strength by removing organic film on the surface of the material to be coated and hydrophilizing the plastic surface with the energy of ultraviolet rays and ozone (O3) generated by irradiating short-wavelength ultraviolet rays (UV: ultraviolet) emitted from a low pressure mercury lamp.

Generally, cleaning surface modification equipment using low-pressure mercury vapor lamps is called "UV ozone cleaners," "UV cleaning equipment," "UV surface modification equipment," etc.


Excimer irradiation equipment

エキシマ照射装置

Excimer lamps utilize light (excimer light) generated by discharge plasma (dielectric barrier discharge) in a lamp filled with a rare gas. We offer equipment for surface modification and hydrophilic treatment (wettability improvement) using a lamp unit with a main wavelength of 172 nm that utilizes Xe2.


Plasma surface reforming equipment

プラズマ改質装置 PS150
Plasma surface reforming equipment PS150

The energy, including charged particles formed by the plasma, breaks up the bonds of induced contaminants on the substrate surface. The oxygen radicals formed also chemically bond with organic contaminants and decompose them into volatile substances such as carbon dioxide and water, which are then removed.


Wet Cleaning

Substances that may adversely affect the adhesion, appearance, and optical properties of the coating film, such as adhesion during the molding process and contamination during transport, must be removed prior to dip coating. Wet cleaning using oscillation and ultrasonic cleaning can be applied prior to dip coating to remove contaminants and improve the adhesion of the coating solution.


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